PRODUCTS SUPPORTED

310PC

SYSTEM CONFIGURATION

This 310PC tool is a manual loading dep system, designed for research and development and small scale production.

The system consists of a combined electronics and process chamber. Other major components of the system not shown in the illustration include the AC distribution box, pumps, remote gas box.

The process chamber is configured for deposition. The plasma is coupled at 13.56 MHz via the matching unit into an aluminium chamber. This provides a plasma capable of operating in a very wide process range.

The system is designed for maximum process flexibility and reproducibility. Process gas is introduced to the chamber through the upper cover assembly. The substrates are placed on the electrode assembly.

The chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable chamber environment leading to processes of the highest quality.

After loading of the wafer into the process chamber, the system automatically carries out pump-down after which the process is started.

System control is via a standard PC which provides fully automatic and user friendly operation. A colour monitor displays process information and mimic displays, allowing the system to be easily operated and continuously monitored. Process recipes may be downloaded to hard or floppy disk, allowing secure storage of unlimited numbers of recipes.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

320PC

SYSTEM CONFIGURATION

This 320PC tool is a manual loading etch system, designed for research and development and small scale production.

The system consists of a combined electronics and process chamber. Other major components of the system not shown in the illustration include the prime power cabinet, pumps, remote gas box and the deionised water chiller.

The process chamber is configured for etching. The plasma is coupled at 13.56 MHz via the matching unit into an aluminium chamber. This provides plasma capable of operating in a very wide process range.

The system is designed for maximum process flexibility and reproducibility. Process gas is introduced to the chamber through the upper cover assembly. The substrates are placed on the electrode assembly which is powered at 13.56 MHz. Temperature control of the substrate platen which is required for certain processes is achieved using a re-circulating de-ionised water system.

The chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable chamber environment leading to processes of the highest quality.

After loading of the wafer into the process chamber, the system automatically carries out pump-down after which the process is started.

System control is via a standard PC which provides fully automatic and user friendly operation. Colour monitors displays process information and mimic displays, allowing the system to be easily operated and continuously monitored. Process recipes may be downloaded to hard or floppy disk, allowing secure storage of unlimited numbers of recipes.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

308PC

SYSTEM CONFIGURATION

This 308PC tool is a manual loading etch system, designed for research and development and small scale production.

The system consists of a combined electronics and process chamber. Other major components of the system include the prime power cabinet, pumps and, remote gas box.

The process chamber is configured for etching. The plasma is coupled at 13.56 MHz via the matching unit onto an aluminium Faraday cage in the chamber. This provides plasma capable of operating in a very wide process range.

The system is designed for maximum process flexibility and reproducibility. Process gas is introduced into the chamber through the upper gas inlet assembly. The substrates are placed on the shelf of the Faraday Cage assembly which is powered at 13.56 MHz.

The chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable chamber environment leading to processes of the highest quality.

After loading of the wafer into the process chamber, the system automatically carries out pump-down after which the process is started.

System control is via a standard PC which provides fully automatic and user friendly operation. Colour monitors displays process information and mimic displays, allowing the system to be easily operated and continuously monitored. Process recipes may be downloaded to hard or floppy disk, allowing secure storage of unlimited numbers of recipes.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

MULTIPLEX ICP

SYSTEM CONFIGURATION

Mesc Multiplex ICP System The Mesc Multiplex ICP system is designed for maximum process flexibility and reproducibility. The process chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable process chamber environment leading to processes of the highest quality.

The Mesc Multiplex ICP system consists of:

  • A process chamber
  • A load lock (single wafer or carousel) assembly
  • A prime power distribution/process chamber electronics rack
  • A gas box (on board or remote)

Other major components of the Mesc Multiplex ICP system, not shown, include, an R.F. stack, chiller(s) and a compressed air system

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

MULTIPLEX CVD

SYSTEM CONFIGURATION

Mesc Multiplex CVD System
The Mesc Multiplex CVD system is designed for maximum process flexibility and reproducibility. The process chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable process chamber environment leading to processes of the highest quality.
The Mesc Multiplex CVD system consists of:
  • A process chamber
  • A load lock (single wafer or carousel) assembly
  • A prime power distribution/process chamber electronics rack
  • A gas box (on board or remote)
Other major components of the Mesc Multiplex CVD system, not shown, include, an R.F. stack, chiller(s) and a compressed air system.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

MULTIPLEX RIE

SYSTEM CONFIGURATION

Mesc Multiplex RIE System
The Mesc Multiplex RIE system is designed for maximum process flexibility and reproducibility. The process chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable process chamber environment leading to processes of the highest quality.
The Mesc Multiplex RIE system consists of:
  • A process chamber
  • A load lock (single wafer or carousel) assembly
  • A prime power distribution/process chamber electronics rack
  • A gas box (on board or remote)
Other major components of the Mesc Multiplex RIE system not shown, include, an R.F. , chiller(s) and a compressed air system.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

MULTIPLEX AOE

SYSTEM CONFIGURATION

Mesc Multiplex AOE System
The Mesc Multiplex AOE system is designed for maximum process flexibility and reproducibility. The process chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable process chamber environment leading to processes of the highest quality.
The Mesc Multiplex AOE system consists of:
  • A process chamber
  • A load lock (single wafer or carousel) assembly
  • A prime power distribution/process chamber electronics rack
  • A gas box (on board or remote)
Other major components of the Mesc Multiplex AOE system not shown, include, an R.F. stack, chiller(s) and a compressed air system.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL

MULTIPLEX HRM

SYSTEM CONFIGURATION

Mesc Multiplex HRM System
The Mesc Multiplex HRM system is designed for maximum process flexibility and reproducibility. The process chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks. This results in a very stable process chamber environment leading to processes of the highest quality.
The Mesc Multiplex HRM system consists of:
  • A process chamber
  • A load lock (single wafer or carousel) assembly
  • A prime power distribution/process chamber electronics rack
  • A gas box (on board or remote)
Other major components of the Mesc Multiplex HRM system not shown, include, an R.F. stack, chiller(s) and a compressed air system.

TECHNICAL MANUAL, SPARE PARTS MANUAL, SERVICE MANUAL